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Apple may soon enter another era of semiconductor technology, thanks to its collaboration with TSMC. New reports suggest that the chip manufacturer plans to begin test production of chips below 1 nm as early as 2029. While this sounds like a distant future, the work on these solutions is already underway.
The road to below 1 nm is already planned
However, before we see breakthrough sub-nanometre architectures, TSMC is planning the next step, the 1.4 nm process, which is expected to appear around 2028. According to leaks, it is set to deliver approximately a 15% increase in performance and even 30% better energy efficiency compared to current solutions. Only after that will the stage below 1 nm arrive, which is expected to further increase transistor density and the capabilities of the architectures. For Apple, this means an opportunity to create even more powerful and simultaneously more energy-efficient chips for iPhones, Macs, and other devices in the next decade.
Greater power but also greater costs
Although the development sounds impressive, it is not without problems. The production of such advanced chips is extremely difficult and costly, and the yields (the number of functional chips from one process) still pose a significant challenge. This means that the first chips below 1 nm will likely end up only in the most expensive devices. In practice, we can expect that new technologies will mainly be available in top models, and the prices of such equipment may rise even further.
The sub-1 nm era is approaching rapidly, but the biggest gains in performance may come with even higher device prices.
source: digitaltrends
