Redakcja Choose TV
Apple may soon enter another era of semiconductor technology, all thanks to its collaboration with TSMC. New reports indicate that the chip manufacturer plans to begin test production of circuits below 1 nm as early as 2029. Although this sounds like a distant future, the work on these solutions is already underway.
The road to below 1 nm is already planned
However, before we see breakthrough sub-nanometer designs, TSMC plans the next step in the 1.4 nm process, expected to arrive around 2028. According to leaks, it is expected to provide about a 15% increase in performance and even 30% better energy efficiency compared to current solutions. Only then will we enter the stage below 1 nm, which is expected to further increase transistor density and device capabilities. For Apple, this means an opportunity to create even stronger and more energy-efficient chips for iPhones, Macs, and other devices in the next decade.
Greater power but also greater costs
Although development sounds impressive, it is not without problems. The production of such advanced chips is extremely difficult and expensive, and yields (i.e., the number of functional chips from a single process) still pose a significant challenge. This means that the first chips below 1 nm will likely only end up in the most expensive devices. In practice, we can expect that new technologies will mainly be available in flagship models, and the prices of such equipment may rise even further.
The sub-1 nm era is approaching rapidly, but the greatest gains in performance may be accompanied by even higher device prices.
source: digitaltrends
