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Samsung and TSMC have been competing for years for the top spot in manufacturing the most advanced semiconductor chips. Although the Taiwanese company still dominates the foundry services market, Samsung can leverage strengths that go beyond the lithography process itself. According to the latest reports, the Korean firm is tightening cooperation with Broadcom on projects related to AI infrastructure. Both the 2 nm process node and advanced HBM4 memory are set to play a key role. The collaboration is expected to involve much more than chip production alone. If the plans are realised, Samsung could significantly strengthen its position in the AI market.
Samsung chce zaoferować Broadcomowi kompleksowe rozwiązanie dla układów AI
According to published reports, Samsung and Broadcom have signed a memorandum of cooperation to develop artificial intelligence infrastructure. The partnership is set to include use of the 2 nm process and HBM4 memory in AI accelerators designed by Broadcom. Samsung will be responsible not only for manufacturing the chips themselves. The company will also take part in design optimisation, chip packaging and preparing them for mass production. This model of cooperation should shorten the time needed to develop new designs. In the future Samsung also plans to roll out the next-generation HBM4E memory. The manufacturer hopes this will increase the competitiveness of its solutions for the AI market. Use of the 2 nm process is expected to cover, among other things, Broadcom's high-speed communications chips. According to the source, the total value of the collaboration could reach as much as $200 billion over a five-year period. It should be noted, however, that the financial details and the scope of the project have not been officially confirmed by either party. Currently only the signing of a memorandum of cooperation is known. Further development of the partnership will depend on the completion of subsequent project stages. For now this remains an ambitious plan rather than a final binding agreement.
Samsung may be able to leverage an advantage from making memory and chips
According to a source, Samsung's biggest asset is its ability to deliver a comprehensive ecosystem to customers. The company manufactures both the most advanced integrated circuits and DRAM and HBM memory. That lets it simultaneously optimise chip design, the power delivery system and the thermal characteristics of the entire design. For TSMC, achieving a similar effect requires cooperation with third‑party memory manufacturers. That can lengthen the design process and increase the risk of integration issues between components. Samsung is betting that this approach will appeal to companies developing AI accelerators. Fewer suppliers could also reduce supply‑chain problems. At the same time, TSMC remains the leader in foundry services and holds a very strong position in producing the most advanced chips. So it's hard to say today whether Samsung will actually manage to close the gap with its biggest rival. It's worth remembering that some of the forecasts cited come from industry analyses and do not represent official statements from either company. The ultimate impact of the collaboration on the market can only be assessed once production of the new chips is up and running. The rivalry between Samsung and TSMC looks set to be highly interesting in the years ahead.
Samsung could leverage a 2 nm process combined with its own HBM4 memory to attract customers developing AI chips. While TSMC remains the market leader, the South Korean manufacturer's comprehensive offering could prove a significant selling point in the battle for the next multibillion-dollar contracts.
source: wccftech
