Katarzyna Petru
LG Electronics has signed a memorandum of understanding (MOU) with Flex, a global leader in the production and innovation of infrastructure for data centers. The aim of the partnership is to jointly develop integrated, modular cooling systems that will meet the increasing thermal challenges in data centers of the artificial intelligence era.
Cooling for the Future of Data
Modern data centers are becoming increasingly densely packed with equipment, which requires advanced heat dissipation technologies. Through the partnership, the following will be combined:
LG cooling modules – including CRAC systems, CRAH units, chillers, coolant distribution units (CDU), and monitoring solutions,
with the Flex portfolio, which includes liquid cooling technologies, power products, and IT infrastructure.
As a result, data center operators will gain flexibility in customizing and scaling infrastructure alongside the growing demand for computing power.
Global Expansion of LG in the AI Data Center Sector
LG is intensively developing its activities in the data center industry worldwide. The company is already implementing projects, including:
in Jakarta, where one of the largest AI data centers in Indonesia is being built,
in the Middle East and Africa – in collaboration with DATAVOLT,
and in North America, where it is providing cooling systems for a hyperscale data center.
Together with LG Uplus, a telecommunications operator belonging to LG Corp., the company has also carried out a test implementation of liquid cooling technology. Currently, LG is developing the next generation of CDU units and cooling plates, which are expected to be available for commercial use later this year.
AI and Efficiency First
LG showcased its latest cooling solutions at Data Center World Asia 2025 in Singapore, continuing the premiere from the previous edition in Washington, D.C.
Michael Hartung, President and Chief Commercial Officer of Flex, emphasizes:
“Through our collaboration with LG, we now offer a full range of cooling solutions that help our clients deal with the increasing heat challenges in data centers. Together, we will deliver prefabricated, scalable infrastructure systems that accelerate deployments and enhance efficiency.”
New generation of data infrastructure
The jointly developed solutions will be integrated into the Flex AI Infrastructure platform – the first globally produced platform for data centers, integrating power, cooling, computing power, and services in a modular form.
As summarized by James Lee, president of LG ES Company:
“We are strengthening our position in the AI data center segment by strategically collaborating with global leaders. Our partnership with Flex gives us new momentum for expansion and allows us to offer unique value to customers around the world.”
