Redakcja Choose TV
Apple is preparing a significant technological leap in its chips. According to the latest information, the M5 Pro and M5 Max models may utilize an unconventional design with vertically stacked components. This solution resembles 3D packaging, which until now has been reserved mainly for the most advanced systems.
New Fusion Architecture Instead of Classic Design
Apple is moving away from typical, uniform chip designs. The M5 Pro and M5 Max feature Fusion Architecture, which is based on experiences from earlier Ultra chips. Instead of one large chip, Apple divides functions into different parts that are closely connected. Importantly, these are not identical blocks, but rather different segments with specific tasks. This approach aims to increase flexibility and allow for better utilization of power.
Vertical Chip Stacking and Greater Efficiency
The most interesting change is the vertically stacked "die", meaning the chip elements are arranged one on top of the other. This allows data to move faster, with lower latency and reduced power consumption. The result is potentially a much higher performance of CPU and GPU, especially in tasks that require rapid communication between components. A downside to this solution may be temperature, as more elements are "compressed" in one place. Interestingly, initial tests suggest that M5 Max may be cooler than its predecessor, which sounds quite surprising.
However, it is important to approach this information with caution. The reports are based on interviews and there are no official images of the chips yet to confirm the design. There are also voices suggesting that some interpretations may not be entirely precise, so full confirmation still needs to wait.
If these reports are confirmed, Apple may take another step towards advanced 3D-inspired chip design. The M5 Pro and M5 Max may not only boost performance but also set the direction for the entire industry. For now, however, this is a technology to be watched with a bit of caution.
source: wccftech.com
