Redakcja Choose TV
Samsung and TSMC have been competing for years for the lead in producing the most advanced integrated circuits. Although the Taiwanese manufacturer still dominates the foundry services market, Samsung can leverage advantages that go beyond the lithography process itself. According to the latest reports, the Korean company is tightening cooperation with Broadcom on AI infrastructure projects. Both the 2 nm process technology and modern HBM4 memory are expected to play key roles. The collaboration is set to involve much more than chip manufacturing alone. If these plans are realized, Samsung could significantly strengthen its position in the AI market.
Samsung wants to offer Broadcom a comprehensive solution for AI chips
According to published reports, Samsung and Broadcom have signed a memorandum of cooperation on developing artificial intelligence infrastructure. The partnership is set to include the use of a 2 nm process node and HBM4 memory in AI accelerators designed by Broadcom. Samsung will be responsible not only for manufacturing the chips themselves but also for optimizing the design, chip packaging, and preparing them for mass production. This cooperation model should shorten the time needed to develop new designs. In the future Samsung also plans to introduce the next-generation HBM4E memory. The company expects this will increase the competitiveness of its solutions for the AI market. The 2 nm process is expected to cover, among other things, Broadcom’s high-speed communication chips. According to the source, the total value of the collaboration could reach as much as $200 billion over five years. However, financial details and the scope of the project have not been officially confirmed by either party. Currently only the signing of the memorandum is known. Further development of the partnership will depend on completing the next stages of the project. For now, this remains an ambitious plan rather than a finalized contract.
Samsung could leverage an advantage from producing memory and chips
The source notes that Samsung’s biggest asset is the ability to deliver customers a comprehensive ecosystem. The company produces both the most advanced integrated circuits and DRAM and HBM memory. Because of this, it can simultaneously optimize chip design, the power delivery system, and the thermal characteristics of the overall design. For TSMC, achieving a similar effect requires cooperation with external memory suppliers. That can lengthen the design process and increase the risk of integration issues between components. Samsung hopes this approach will be attractive to companies developing AI accelerators. Fewer suppliers could also limit supply-chain problems. At the same time, TSMC remains the market leader in foundry services and holds a very strong position in producing the most advanced chips. So it’s hard to say today whether Samsung will actually be able to close the gap with its biggest competitor. It’s worth remembering that some of the forecasts presented come from industry analyses and are not official statements from either company. The ultimate impact of the collaboration on the market will only be clear after production of the new chips begins. The rivalry between Samsung and TSMC, however, promises to be extremely interesting in the years ahead.
Samsung could leverage a 2 nm process combined with its own HBM4 memory to attract customers developing AI chips. Although TSMC remains the market leader, the Korean manufacturer's comprehensive offering could prove a significant factor in the race for the next multibillion-dollar contracts.
source: wccftech
