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Apple is preparing a significant technological leap in its chips. According to the latest information, the M5 Pro and M5 Max models may utilise an unusual design with vertically stacked components. This solution resembles 3D packaging, which has so far been reserved mainly for the most advanced systems.
New Fusion Architecture instead of traditional design
Apple is moving away from the typical, uniform chip design. The M5 Pro and M5 Max feature Fusion Architecture, which is based on experiences from previous Ultra chips. Instead of one large silicon chip, Apple divides functions into different parts that are closely interconnected. Importantly, these are not identical blocks, but various segments with specific tasks. This approach aims to increase flexibility and enable better utilisation of power.
Vertical chip stacking and increased efficiency
The most interesting change is the vertically stacked 'dies', meaning chip elements arranged one on top of the other. This allows data to move faster, with less latency and lower energy consumption. The result is potentially much higher CPU and GPU performance, particularly in tasks that require rapid communication between components. A downside to this solution could be temperature, as more elements are 'packed' in one place. Interestingly, early tests suggest that M5 Max may be cooler than its predecessor, which sounds quite surprising.
However, it is worth approaching this information with caution. The reports are based on interviews, and there are still no official images of the chips that would confirm the design. There are also voices suggesting that some interpretations may not be entirely precise, so we’ll have to wait for full confirmation.
If this information is confirmed, Apple may take another step towards advanced 3D-inspired chip design. The M5 Pro and M5 Max might not only boost performance but also show the direction for the entire industry. For now, however, this is a technology that should be watched with a bit of scepticism.
source: wccftech.com
