Katarzyna Petru
LG Electronics has signed a memorandum of understanding (MOU) with Flex, a global leader in the production and innovation of infrastructure for data centres. The aim of the partnership is to jointly develop integrated, modular cooling systems that will meet the increasing thermal challenges in data centres of the artificial intelligence era.
Cooling for the Future of Data
Modern data centres are becoming increasingly densely packed with equipment, which requires advanced heat dissipation technologies. As part of the partnership, the following will be combined:
LG Cooling Modules – including CRAC systems, CRAH systems, chillers, cooling distribution units (CDUs), and monitoring solutions,
with the Flex portfolio, which includes liquid cooling technologies, power products, and IT infrastructure.
This will provide data centre operators with the flexibility to adapt and scale their infrastructure in line with the increasing demand for computing power.
Global Expansion of LG in the AI Data Center Sector
LG is rapidly developing its business in the data centre industry worldwide. The company is already implementing projects including:
in Jakarta, where one of the largest AI data centres in Indonesia is being established,
in the Middle East and Africa – in collaboration with DATAVOLT,
and in North America, where it supplies cooling systems for hyperscale data centres.
Together with LG Uplus, a telecommunications operator belonging to LG Corp., the company has also carried out a test implementation of liquid cooling technology. Currently, LG is developing the next generation of CDU units and cooling plates, which are expected to be available for commercial use later this year.
AI and Efficiency at the Forefront
LG showcased its latest cooling solutions at Data Center World Asia 2025 in Singapore, continuing from the launch at the previous edition in Washington.
Michael Hartung, President and Commercial Director of Flex, emphasises:
“Through our partnership with LG, we now offer a full range of cooling solutions that help our clients tackle the growing heat issue in data centres. Together, we will deliver prefabricated, scalable infrastructure systems that will accelerate deployments and enhance efficiency.”
New Generation of Data Infrastructure
The jointly developed solutions will go to the Flex AI Infrastructure platform – the world's first mass-produced platform for data centres, integrating power, cooling, computing power, and services in a modular form.
As James Lee, president of LG ES Company, sums up:
“We are strengthening our position in the AI data centre segment by strategically partnering with global leaders. Our partnership with Flex gives us a new impetus for expansion and allows us to offer unique value to customers worldwide.”
