Katarzyna Petru
LG Electronics has signed a memorandum of understanding (MOU) with Flex, a global leader in the production and innovation of infrastructure for data centres. The aim of the partnership is to jointly develop integrated, modular cooling systems that will meet the increasingly challenging thermal demands in data centres of the artificial intelligence era.
Cooling for the Future of Data
Modern data centres are becoming increasingly densely packed with equipment, which requires advanced heat dissipation technologies. Through this partnership, the following will be combined:
LG Cooling Modules – including CRAC systems, CRAH, chillers, coolant distribution units (CDU), and monitoring solutions,
with the Flex portfolio, which includes liquid cooling technologies, power supply products, and IT infrastructure.
As a result, data centre operators will gain flexibility in customising and scaling their infrastructure to meet the growing demand for computing power.
LG's Global Expansion in the AI Data Centre Sector
LG is actively developing its business in the data centre industry worldwide. The company is already undertaking projects including:
in Jakarta, where one of the largest AI data centres in Indonesia is being constructed,
in the Middle East and Africa – in collaboration with DATAVOLT,
and in North America, where it is providing cooling systems for a hyperscale data centre.
Together with LG Uplus, a telecommunications operator owned by LG Corp., the company has also implemented a test deployment of liquid cooling technology. Currently, LG is developing the next generation of CDU units and cooling plates, which are expected to be available for commercial use later this year.
AI and Efficiency First
LG has showcased its latest cooling solutions at Data Center World Asia 2025 in Singapore, continuing the launch from the previous edition in Washington.
Michael Hartung, President and Chief Commercial Officer of Flex, emphasises:
“By partnering with LG, we now offer a full range of cooling solutions that help our clients tackle the growing heat issue in data centres. Together, we will deliver prefabricated, scalable infrastructure systems that expedite deployments and enhance efficiency.”
New generation of data infrastructure
The solutions developed together will be delivered to the Flex AI Infrastructure platform – the first globally produced platform for data centres, integrating power, cooling, computing power and services in a modular form.
As summarised by James Lee, president of LG ES Company:
“We are strengthening our position in the AI data centre segment by strategically collaborating with global leaders. The partnership with Flex gives us a new impetus for expansion and allows us to offer unique value to customers worldwide.”
