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Apple is preparing a significant technological leap in its chips. According to the latest information, the M5 Pro and M5 Max models may utilise an unusual design with vertically stacked components. This solution resembles 3D packaging, which until now has been reserved mainly for the most advanced circuits.
New Fusion architecture instead of traditional design
Apple is moving away from the typical, uniform chip design. The M5 Pro and M5 Max feature Fusion Architecture, which builds on experiences from earlier Ultra chips. Instead of one large chip, Apple divides functions into different parts that are closely interconnected. Importantly, these are not identical blocks, but various segments with specific tasks. This approach aims to increase flexibility and allow for better utilisation of power.
Vertical Chip Stacking and Increased Efficiency
The most interesting change is the vertically stacked "die", meaning chip components arranged one on top of the other. This allows data to move faster, with less latency and lower power consumption. The result is potentially much higher CPU and GPU performance, especially in tasks requiring rapid communication between components. A downside of this solution might be temperature, as more components are "packed" in one place. Interestingly, early tests suggest that M5 Max may be cooler than its predecessor, which sounds quite surprising.
However, it is worth approaching this information cautiously. The reports are based on interviews and there are no official images of the chips yet to confirm the design. There are also voices that some interpretations may not be entirely accurate, so we still need to wait for full confirmation.
If this information is confirmed, Apple may take another step towards advanced 3D-inspired chip design. The M5 Pro and M5 Max might not only boost performance but also set a direction for the entire industry. For now, however, it’s a technology that needs to be watched with a bit of caution.
source: wccftech.com
